Temperature simulation of system-in-package produced with hybrid chip mounting technology
نویسندگان
چکیده
منابع مشابه
Integrated Chip–Package–System Simulation
Opportunities are wide open, all across the board. Smart technologies enable countless new applications, driving a range of end-use market sectors and boosting semiconductor sales. The number of networked devices is growing exponentially and globally. R&D teams rapidly pair devices with services, applications and content. At the same time, private companies — not just government agencies or mil...
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As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologies. This movement is occurring at all levels: at the IC, at the IC package, at the module, at the hybrid, the PC board which ties all the systems together. Interconnection density and methodology becomes ...
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چکیده پلاتین، فلزی نجیب، پایدار و گران قیمت با خاصیت کاتالیزوری زیاد است که کاربرد های صنعتی فراوانی دارد. کمپلکس های پلاتین(ii) به عنوان دارو های ضد سرطان شناخته شدند و در شیمی درمانی بیماران سرطانی کاربرد دارند. خاصیت کاتالیزوری و عملکرد گزینشی پلاتین مستقیماً به اندازه و- شکل ماده ی پلاتینی بستگی دارد. بعضی از نانو ذرات فلزی در سطح مشترک مایع- مایع سنتز شده اند، اما نانو ساختار های پلاتین ب...
Full-Chip CMP Simulation System
In this paper, we present a Full-chip CMP simulation system. We discuss three problems in practical use of CMP simulation system: how to handle huge chip data, ECP model accuracy, and how to predict the errors effectively. We propose solutions to the problems as follows: First, we develop a data extraction tool from GDSII. Dummy fill insertion function of this tool can reduce the data size of G...
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ژورنال
عنوان ژورنال: IOP Conference Series: Materials Science and Engineering
سال: 2019
ISSN: 1757-899X
DOI: 10.1088/1757-899x/630/1/012013